Temperature Resistance, Thermal Shock Resistance, Density, and other important Properties

Hexagonal Boron Nitride offers a unique combination of properties that cannot be found in any other material

  • low density (approx 2,2 g/cm3),
  • high thermal cycling resistance
  • high thermal conductivity
  • resistance to most acids and melts
  • electrical insulation
  • very high oxidation resistance
  • low coefficient of friction
  • and excellent machinability

Temperature  resistance

In air, Boron Nitride is useable to temperatures as high as 950°C. In inert or vacuum conditions, to temperatures in excess of 2500°C.

Melting Point/Decomposition Temperature

Thermal shock resistance

Like all nitrides, boron nitride has a very low coefficient of thermal expansion, similar to that of graphite. Thermal expansion of boron nitride may vary in accordance with production methods
and composition:

Thermal Expansion

As a result of its low thermal expansion, the resistance of boron nitride to thermal shock is superior to that of other high temperature ceramic materials.

Density

Boron nitride has the lowest density of all ceramic materials:

Density

Owing to its low density and excellent machinability boron nitride is the ideal material for light components in aerospace applications, providing solutions for a wealth of technical problems.

Important parameters

As is the case with Graphite, Boron Nitride powders can be characterised by six interrelated parameters:

Hexagonal Boron Nitride

Structurally, hexagonal Boron Nitride is very similar to Graphite. However, because the Nitrogen effectively binds the outer electrons firmly to it, hexagonal BN is superior to Graphite in the following areas: