Boron Nitride fillers
for heat conducting polymers

State-of-the-art limitations in thermal management

Up to now for heat removal from electrical or mechanical assembly groups metal cooling elements are used. Usually such elements are linked to the energy loss / heat generating assembly groups by screwing, adhering or surrounding by polymers. Therewith costs for assembly increase and often additional parts for the purpose of electrical insulation are needed, like discs of mica or ceramics, foils, etc. By doing so, heat flow is more limited by contact or transfer resistances rather than by the “bulk” thermal conductivity of the cooling elements themselves.

Extending functionality and fields of application with thermoplastics, elastomers and thermosetting plastics by means of HeBoFill® heat conducting and self lubricating Boron Nitride fillers

An innovative way to produce functional, heat conducting parts is the use of thermal conducting polymers. Hexagonal Boron Nitride meets the requirements of a heat conducting filler for polymers like no other. Especially our HeBoFill® 500-Series is optimized to achieve highest heat conductivities in polymers together with excellent electrical insulating properties (HeBoFill® 501, 511, 541).

Polymers including HeBoFill® Boron Nitride Fillers can be used for insert moldings to achieve best contact and mechanical fixing of the heat generating part. Heat can be conducted out of such assemblies much more effective because many functions are incorporated at once:

• Form closure
• Thermal energy transfer to the heat sink
• Electrical insulation
• Protection towards the environment (moisture, vibration, dirt)

Additional the superior lubricating properties of hexagonal Boron Nitride increase the speed of production and reduce the wear of the production equipment. Boron Nitride also increases the lubricity and wear resistance of the final polymer parts. Especially its lubrication makes it superior to common fillers like alumina or aluminum nitride (AlN) by

• filling the mold cavities prior to the freezing of the polymer,
• allowing higher pressures despite of higher viscosities, and
• shortening production cycles.

Due to the platelet structure of Boron Nitride particles an orientation during molding takes place, thus leading to a higher thermal conductivity „in plane“ than „through plane“ in order of times 2. This is of advantage for heat dispersion and discharge, e.g. at the base of cooling fins. 

Depending on the kind of application nearly all polymers can put to use with HeBoFill® Boron Nitride heat conducting fillers, even for high temperatures up to 350°C or thermally very sensitive assemblies.

Improved heat conductivity and heat dispersion
with HeBoFill® Boron Nitride fillers

Heat conductivity of different fillers and achievable heat conductivies of polymers therewith

Find a technical solution in the area of functional polymers!
Please contact us.

Service Plus from HENZE

In order to offer our customers all utilisation options of Boron Nitride fillers for tailor-made polymer capabilities HENZE cooperates with compounders well established in various industries in the development and the compounding of high performance polymers. Benefit from:

• detailed application consulting service
• development of formulas based on customers' specific requirements
• detailed test runs in our technical centre
• individual colour design due to a wide range of colour selection
• a wide range of additive possibilities
• pilot series development
• guaranteed homogenous lots up to 20 tons
• material testing and guaranteed quality