HeBoFill® CL-ADH 015 is a high-performance boron nitride powder with a high agglomerate density and pronounced crystallinity combined with a low specific surface area. The targeted agglomeration of individual crystallites makes it ideal as an additive in plastics to increase thermal conductivity with electrical insulation and limitation in the particle size that can be used.
Thanks to its dense particle structure, HeBoFill® CL-ADH 015 enables high filling levels at low viscosity - perfect for liquid systems with demanding performance. The compact agglomerate form reduces the anisotropy of the boron nitride and ensures increased through-plane thermal conductivity.
Like all HeBoFill® BN powders, it also has a lubricating effect on processing machines and thus reduces wear.
Typical areas of application
- Liquid systems such as adhesives and potting compounds
- Thermal interface materials, gap fillers
- Applications with particle size limitations
The product highlights at a glance!
- High thermal conductivity
- High degree of agglomeration with high density
- Small particle size
- Best flowability
- Low viscosity increase
- High purity
- Enables highest filling levels
- Low specific surface area
- No metal abrasion in the end product
- Minimal tool wear compared to other fillers
* HeBoFill Cool Line – Agglomerate density high + D50