For components with extreme heat dissipation requirements, we have developed special high-performance mixed ceramics such as HeBoSint® SL-A 800. This material, based on aluminum nitride and boron nitride, impresses with its outstanding thermal conductivity of 115 W/mK and excellent electrical insulation. It is an ideal and cost-effective solution for state-of-the-art applications in semiconductor technology, power electronics, X-ray technology and aerospace.