HeBoFill® CL-SP 009

Boron Nitride Powder

HeBoFill® CL-SP 009* has a low specific surface area due to its special particle size distribution. Even at higher filling levels, this means that the viscosity does not increase as much in the plastic matrix. The individual crystallites are in the medium size range of 9 µm and thus in the midfield of our powder portfolio. The boron nitride powder is ideal for applications where the filler particle size is limited.

In addition to its good thermal conductivity, HeBoFill® CL-SP 009* also impresses with good lubricating properties and low hardness. Consequently, the abrasion on mixing tools is very low. Other fillers such as aluminium oxide and magnesium oxide show a significantly stronger abrasive reaction with a lower thermal conductivity.

Typical applications

  • filler for thermal conductive pastes, potting compounds, plastic sheathing
  • filler for injection moulding applications
  • filler for silicones, thermoplastics, duromers and elastomers

The product highlights

  • good thermal conductivity
  • high crystallinity of the powder
  • low specific surface
  • no metal abrasion in the end product
  • minimal tool wear compared to other fillers

* HeBoFill Cool Line - Single Platelet + D50

 

Did you know:
HENZE BNP develops boron nitride powder in accordance with customer-specific requirements.

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